A memorandum of understanding to expand cooperation between Taiwan and Lithuania on laser technology for heterogeneous integration in advanced semiconductor packaging was concluded Sept. 4 in Taipei City.
According to the Ministry of Foreign Affairs, the signatories were the government-backed Industrial Technology Research Institute in Hsinchu County, Taiwan Electronic Equipment Industry Association, Taiwan Electrical and Electronic Manufacturers’ Association, the Lithuanian Laser Association, and the Center for Physical Sciences and Technology.
The ceremony took place during the SEMICON Taiwan exhibition, the MOFA said, adding that Foreign Minister Lin Chia-lung and Lithuanian Trade Representative to Taiwan Karolis Pilipauskas were both present to witness the event.
The ministry said the arrangement built on the success of the Ultrafast Laser Technology Research and Innovation Center jointly created in 2023 by the two countries.
Speaking at the ceremony, Lin praised the pact as an example of the government’s policy for integrated diplomacy. The government will provide 5.6 million euros (US$6.5 million) to jointly develop advanced laser technologies and equipment, he said, adding that the initiative marks a key milestone in Taiwan’s efforts to work with the like-minded partner to strengthen global semiconductor supply chain resilience.
According to the ITRI, Pilipauskas said the pact will help enhance his country’s supply of relevant components, and thanked the government of Taiwan for its long-standing support in expanding bilateral trade and economic cooperation.
The ITRI expects the agreement to help create sales of 15 sets of integrated packaging systems over a two-year period, and generate accumulated output topping NT$500 million (US$15.8 million) in the next five years. (SFC-E)
Write to Taiwan Today at ttonline@mofa.gov.tw
According to the Ministry of Foreign Affairs, the signatories were the government-backed Industrial Technology Research Institute in Hsinchu County, Taiwan Electronic Equipment Industry Association, Taiwan Electrical and Electronic Manufacturers’ Association, the Lithuanian Laser Association, and the Center for Physical Sciences and Technology.
The ceremony took place during the SEMICON Taiwan exhibition, the MOFA said, adding that Foreign Minister Lin Chia-lung and Lithuanian Trade Representative to Taiwan Karolis Pilipauskas were both present to witness the event.
The ministry said the arrangement built on the success of the Ultrafast Laser Technology Research and Innovation Center jointly created in 2023 by the two countries.
Speaking at the ceremony, Lin praised the pact as an example of the government’s policy for integrated diplomacy. The government will provide 5.6 million euros (US$6.5 million) to jointly develop advanced laser technologies and equipment, he said, adding that the initiative marks a key milestone in Taiwan’s efforts to work with the like-minded partner to strengthen global semiconductor supply chain resilience.
According to the ITRI, Pilipauskas said the pact will help enhance his country’s supply of relevant components, and thanked the government of Taiwan for its long-standing support in expanding bilateral trade and economic cooperation.
The ITRI expects the agreement to help create sales of 15 sets of integrated packaging systems over a two-year period, and generate accumulated output topping NT$500 million (US$15.8 million) in the next five years. (SFC-E)
Write to Taiwan Today at ttonline@mofa.gov.tw
from Taiwan Today – Top News